Product Features
●Supports 9.95 to 10.5Gb/s bit rates
●Duplex LC connector
●Hot pluggable SFP+ footprint
●850nm VCSEL transmitter, PIN photo-detector
●Up to 300m on 50/125um MMF(2000MHZ.KM)
●Low power consumption, < 1W
●Digital Diagnostic Monitor Interface
●Optical interface compliant to IEEE 802.3ae
●Electrical interface compliant to SFF-8431
●Operating case temperature:
Commerical:-20 to 75 °C
Industrial:-40 to 80 °C
Applications
●10G Base-SR/SW at 10.3125G
●10G Fiber Channel
●Other optical links
Product Descriptions
The Transceiver Enhanced Small Form Factor Pluggable SFP+
transceivers are designed for use in 10-Gigabit Ethernet over Multi
Mode fiber. They are compliant with SFF-8431,SFF-8432 and IEEE
802.3ae 10GBASE-SR/SW. The transceiver designs are optimized for
high perform-ance and cost effective to supply customers the best
solutions for telecommunication and datacom.
Functional Diagram
Absolute Maximum Ratings
| Parameter | Symbol | Min. | Max. | Unit | Note |
| Supply Voltage | Vcc | -0.5 | 4.0 | V | |
| Storage Temperature | TS | -40 | 85 | °C | |
| Relative Humidity | RH | 0 | 85 | % | |
Note: Stress in excess of the maximum absolute ratings can cause
permanent damage to the transceiver.
General Operating Characteristics
| Parameter | Symbol | Min. | Typ | Max. | Unit | Note |
Data Rate
| | 9.953 | 10.3125 | 10.518 | Gb/s | |
| Supply Voltage | Vcc | 3.13 | 3.3 | 3.47 | V | |
| Supply Current | Icc5 | | 180 | 280 | mA | |
| Operating Case Temp. | Tc | 0 | | 70 | °C | |
| TI | -40 | | 80 | |
Electrical Characteristics (TOP(C) = -20 to 75 ℃, TOP(I) =-40 to 80 ℃,VCC = 3.13 to 3.47 V)
| Parameter | Symbol | Min. | Typ | Max. | Unit | Note |
| Transmitter |
| Differential data input swing | VINPP | 180 | | 700 | mVpp | 1 |
| Transmit Disable Voltage | VD | 2.0 | | Vcc+0.3 | V | |
| Transmit Enable Voltage | VEN | Vee | | Vee+0.8 |
| Input differential impedance | Rin | | 100 | | Ω | |
| Receiver |
| Differential data output swing | Vout,pp | 300 | | 850 | mVpp | 2 |
| Output rise time and fall time | Tr, Tf | 28 | 2.0 | Vcc+0.3 | Ps | 3 |
| LOS Fault | VLOS_F | 2 | 0 | Vcc_HOST | V | 4 |
| LOS Normal | VLOS_N | Vee | | Vee+0.8 | V | 4 |
Note:
1. Connected directly to TX data input pins. AC coupling from pins
into laser driver IC.
2. Into 100Ω differential termination.
3. 20 – 80%. Measured with Module Compliance Test Board and OMA
test pattern. Use of four 1’s and four 0’s sequence in the PRBS 9
is an acceptable alternative.
4. LOS is an open collector output. Should be pulled up with 4.7kΩ
– 10kΩ on the host board. Normal operation is logic 0; loss of
signal is logic 1.
Optical Characteristics (TOP(C) = -20 to 75 ℃, TOP(I) =-40 to 80 ℃,VCC = 3.13 to 3.47 V)
| Parameter | Symbol | Min. | Typ | Max. | Unit | Note |
| Transmitter |
| Operating Wavelength | λ | 840 | 850 | 860 | nm | |
| Ave. output power (Enabled) | PAVE | -5 | | -1 | dBm | 1 |
| Side-Mode Suppression Ratio | SMSR | 30 | | | dB | |
| Extinction Ratio | ER | 4 | 5.5 | | dB | |
| RMS spectral width | Δλ | | | 0.45 | nm | |
| Dispersion penalty | TDP | | | 3.9 | dB | |
| Relative Intensity Noise | RIN | | | -128 | dB/Hz | |
| Output Optical Eye | Compliant with IEEE 0802.3ae |
| Receiver |
| Operating Wavelength | | 840 | | 860 | nm | |
| Receiver Sensitivity(ER=4) | PSEN1 | | | -10.9 | dBm | 2 |
| Receiver Sensitivity(ER=5.5) | PSEN2 | | | -11.1 | dBm | 3 |
| Average Receive Power | PAVE | | | +0.5 | dBm | |
| Receiver Reflectance | Rrx | | | -12 | dB | |
| LOS Assert | Pa | -30 | -23 | | dBm | |
| LOS De-assert | Pd | | | -14 | dBm | |
| LOS Hysteresis | Pd-Pa | 0.5 | | | dB | |
Notes:
1. Average power figures are informative only, per IEEE 802.3ae.
2. Valid between 840 and 860 nm. Measured with worst ER=4;
BER<10-12; 231 – 1 PRBS.
3. Valid between 840 and 860 nm. Per IEEE 802.3ae
| Pin | Symbol | Name/Description |
| 1 | VEET [1] | Transmitter Ground
|
| 2 | Tx_FAULT [2] | Transmitter Fault
|
| 3 | Tx_DIS [3] | Transmitter Disable. Laser output disabled on high or open
|
| 4 | SDA [2] | 2-wire Serial Interface Data Line |
| 5 | SCL [2] | 2-wire Serial Interface Clock Line
|
| 6 | MOD_ABS [4] | Module Absent. Grounded within the module
|
| 7 | RS0 [5] | Rate Select 0 |
| 8 | RX_LOS [2] | Loss of Signal indication. Logic 0 indicates normal operation |
| 9 | RS1 [5] | Rate Select 1
|
| 10 | VEER [1] | Receiver Ground
|
| 11 | VEER [1] | Receiver Ground
|
| 12 | RD- | Receiver Inverted DATA out. AC Coupled
|
| 13 | RD+ | Receiver DATA out. AC Coupled
|
| 14 | VEER [1] | Receiver Ground
|
| 15 | VCCR | Receiver Power Supply
|
| 16 | VCCT | Transmitter Power Supply
|
| 17 | VEET [1] | Transmitter Ground
|
| 18 | TD+ | Transmitter DATA in. AC Coupled
|
| 19 | TD- | Transmitter Inverted DATA in. AC Coupled
|
| 20 | VEET [1] | Transmitter Ground
|
Notes:
1.Module circuit ground is isolated from module chassis ground
within the module.
2.should be pulled up with 4.7k – 10k ohms on host board to a
voltage between 3.15Vand 3.6V.
3.Tx_Disable is an input contact with a 4.7 kΩ to 10 kΩ pullup to
VccT inside the module.
4.Mod_ABS is connected to VeeT or VeeR in the SFP+ module. The host
may pull this contact up to Vcc_Host with a resistor in the range
4.7 kΩ to10 kΩ.Mod_ABS is asserted “High” when the SFP+ module is
physically absent from a host slot.
5. RS0 and RS1 are module inputs and are pulled low to VeeT with
> 30 kΩ resistors in the module.
Digital Diagnostic Specifications
The transceivers can be used in host systems that require either
internally or externally calibrated digital diagnostics.
| Parameter | Symbol | Units | Min. | Max. | Accuracy | Note |
| Transceiver temperature | DTemp-E | ºC | -45 | +90 | ±5ºC | 1,2 |
| Transceiver supply voltage | DVoltage | V | 2.8 | 4.0 | ±3% | |
| Transmitter bias current | DBias | mA | 0 | 127 | ±10% | 3 |
| Transmitter output power | DTx-Power | dBm | -2 | +3 | ±2dB | |
| Receiver average input power | DRx-Power | dBm | -20 | +1 | ±2dB | |
Notes:
1.When Operating temp.=0~70 ºC,the range will be min=-5,Max=+75
2. Internally measured
3. The accuracy of the Tx bias current is 10% of the actual current
from the laser driver to the las
Package Dimensions
